Built in Taiwan. Scale worldwide. IC Taiwan Grand Challenge
Taiwan’s flagship innovation competition, IC Taiwan Grand Challenge (ICTGC), is building global momentum and inviting groundbreaking startups, research teams, and international founders to apply for Batch 4 of the competition. The competition turns global innovators to Taiwan to prototype, scale, and commercialize next-generation semiconductor and AI technologies.

⏳Time is running out! ICTGC Batch 4 applications close on February 28, 2026.
Start your application today! Save your progress and submit before Feb 28th: https://ictaiwanchallenge.org/

Why apply to the IC Taiwan Grand Challenge?
• USD 30,000 cash prize
• Mentorship, manufacturing access, and corporate partnerships
• Opportunity to showcase at COMPUTEX & InnoVEX 2026 in Taipei
Startups, research teams, and innovators in AI, chips, and deep tech are invited to apply.

Who can apply?
Startups (under 8 years), researchers, and innovators in:
🔹 AI Core technologies & Chips, including applications in AI chip design, Hardware acceleration, and Cybersecurity, etc.
🔹 Smart Mobility, including applications in Communications/Satellite and Electric Vehicles, etc.
🔹 Smart Manufacturing, including applications in IC Process, Robotics, and Intelligent Manufacturing, etc.
🔹 Smart Medtech, including applications in Biometrics, Smart Monitoring, and e-Health, etc.
🔹 Sustainability, including applications in Sustainable Manufacturing, Energy Saving Innovation, and New Energy, etc.

APPLICATIONS AND MORE INFO HERE: https://ictaiwanchallenge.org/

Deadline for Applications: 2026-02-28